Call for Papers – IEEE CAVS 2019

16 April, 2019 | Breaking News, Events & Conferences

2019 IEEE 2nd Connected and Automated Vehicles Symposium: IEEE CAVS 2019
22–23 September 2019, Honolulu, Hawaii, USA
http://ieee-cavs.org/

Extended submission deadline: May 10, 2019


A selection of the best conference papers will be invited to submit to a fast track special section of the IEEE Transactions on Vehicular Technology (IF=4.43). Only papers presented at the conference will be considered. Submissions to the special section need to be extended versions of the conference paper with at least 50% of new content. Regular submissions will also opt for a Best Paper Award and student submissions will opt for a Best Student Paper Award. For the latter, the paper must be presented by the student who is first author of the paper.


With the advances in computing and communication technologies, vehicle technology has entered a new era of connected and automated vehicles (CAVs). The host of technologies that are required to enable CAVs are many and span several engineering and science disciplines. This symposium aims to bring together researchers who are working on different aspects of CAVs. IEEE CAVS is a symposium for reporting advances in all aspects of CAVs, including theory, tools, protocols, networks, applications, systems, test-beds and field deployments. IEEE CAVS 2019 will be held on 22-23 September 2019 in Honolulu, Hawaii, co-located with IEEE VTC-2019 Fall (September 22-25, 2019, http://www.ieeevtc.org/vtc2019fall/). Standalone and combined registrations packages will be offered for IEEE CAVS and IEEE VTC2019-Fall events. Areas of interest include (but are not limited to) the following:

– Autonomous driving
– Motion Planning, Decision-Making, and Controls for CAVs
– Vehicular networks. V2V, V2I and V2X communications
– ADAS technologies, systems and applications
– Artificial Intelligence and Machine Learning for CAVs
– 5G for connected and automated vehicles
– In-vehicle communications
– Sensing, detection, and actuation
– Formal Methods and Model Checking in Autonomous Driving
– Multi-CAV Coordination
– Multi-sensor fusion
– Mapping and localization
– Vision and environment perception
– In-car electronics and embedded software, OS and systems
– Networked automotive cyber-physical systems
– Automotive IoT
– Vehicular and transportation data analytics
– Automotive cybersecurity, liability and privacy
– Smart and shared mobility systems and applications
– Coexistence of CAVs, automated, connected and conventional/legacy vehicles
– Connected and automated vehicle safety applications
– Cooperative driving and cooperative perception/sensing
– Impact of CAVs on transport safety, traffic management, characterization and prediction
– Computer aided modeling, simulation, verification
– Field trials
– Standards development, business models, policies
– Human factors, human machine interfaces and Human-Vehicle Interaction
– Emotion detection in self-driving vehicles
– CAVs and vulnerable road users

Prospective authors are invited to submit 5-page, original, and unpublished full papers. If you have a paper that is longer than 5 pages at the time of final submission, you can purchase up to two (2) excess pages per paper at a cost of $100 USD per page (maximum page count for any final submission is 7 total pages). Manuscripts should be formatted according to IEEE two-column conference style, including figures and references. You can find the template at the CFP section in http://ieee-cavs.org/. Manuscripts should be submitted through trackchair: https://vtc2019f-rr-wks.trackchair.com/track/1764.

All submissions will undergo peer-review by subject matter experts, and the full paper version of accepted submissions will be published in the conference proceedings and submitted to IEEE Xplore (conditional on in-person presentation at the conference). Standalone and combined registrations packages will be offered for IEEE CAVS and IEEE VTC2019-Fall events.

General Co-Chairs
Javier Gozalvez, Universidad Miguel Hernandez de Elche, Spain
Yaser P. Fallah, University of Central Florida, USA
Cem Seraydar, General Motors, USA

Technical Program Co-Chairs
David W. Matolak, University of South Carolina, USA
Panagiotis Tsiotras, Georgia Tech, USA
Dongpu Cao, University of Waterloo, Canada

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