Yihong Qi is an engineer, scientist, inventor, and entrepreneur. He is President and Chief scientist of General Test Systems, Inc., Shenzhen, China. He is founder of Pontosense Inc., Mercku Inc. Canada and Link-E, Zhuhai, China. He is an Honorary Professor at Xidian University and Southwest Jiaotong University. He is also Adjunct Professor in the EMC Laboratory, Missouri University of Science and Technology, Rolla, MO, USA; Western University, Ontario, Canada; Dalian Maritime University, China.
Dr. Qi is an inventor of more than 500 published and pending patents. He has published more than140 academic papers. Dr. Qi’s smartphone antenna design patent significantly reduced harmful radio-wave radiation to the human head, which could potentially help billions of smartphone users reduce potential hazardous electromagnetic radiation. His invention also resolved the hearing aid compatibility issue; there are more than 20-million cell phone users who depend on hearing aid devices. His standards related inventions has have made the certification process for 4G, 5G, and potentially 6G wireless communications and autonomous cars more efficient and cost-effective. His invention of Wideband High efficiency Electromagnetic Structure (WHEMS) has increased iconic Yagi-Uda antenna bandwidth 8 times and halved its maximum size. His invention of O-Shape connector has been widely used in industry, shipping more than 30 billion pieces since 2014. He co-proposed Wireless Intelligent Sensing (WISe) for Heart Rate Variability monitoring , Human Present detection for intelligent connected vehicle s and smart city application.
Dr. Qi was associate professor in Southeast University, China in 1992. From 1995 to 2010, he was with Research in Motion (Blackberry), Waterloo, ON, where he was the Director of Advanced Electromagnetic Research. He was founding Chairman of the IEEE EMC society TC-12. He is associate editor of IEEE Internet of Things Journal and IEEE Transactions on Electromagnetic Compatibility.
Dr. Qi was a Distinguished Lecturer of IEEE EMC Society. He has received an IEEE EMC Society Technical Achievement Award. His inventions won 2019, 2020 CES innovation awards, 2021 CES Network Product award, 2022 CES Wellbeing Product award, Red Dot award, IEEE HI-TC industrial award among other awards. He is a Fellow of Canadian Academy of Engineering, Fellow of National Academy of Inventors, Fellow of IEEE and Fellow of Asia-Pacific Artificial Intelligence Association.